MFG Manufacturer Directory
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ISO9001:2008+AS9100:2009 contract electronics manufacturer since 1985 for advanced printed circuit board, printed wiring board and circuit card assemblies for commercial, industrial and military applications where reliability and continued performance is critical. Quick-turn rapid prototypes and production volumes. SBA certified woman-owned small business (WOSB). Made in Connecticut. Rigid, flex, ridig-flex, ceramic, aluminum metal core (MCPCB), SMT, PTH, BGA, uBGA, flip-chip, 0201, 10mil pitch. Ionic chromatography laboratory in-house for cleanliness testing and robotic hot solder dipping (RHSD) component preparation. DFM/DFT, AOI, x-ray MDA/ICT testing. Parylene, silicone, urethane, epoxy and acrylic conformal coatings. Staking, underfill, potting encapsulation. ESD, MSL and FOD programs. Full lot code control traceability with counterfeit parts mitigation. ITAR/EAR, RoHS REACH compliant. IPC-610 J-STD-001 CLASS 3 and SPACE addendum certified. NADCAP AC7120 expected in 2014.
Hobson and Motzer specializes in precision metal stampings, components and assemblies for medical, automotive and industrial applications. Our capabilities include in-house tool design, tool production, progressive and single stroke stamping, assembly, pad printing, laser welding and project management. Press equipment ranges from 30 tons to 250 tons. Stamp material thickness upto .150", specializing in stainless steel, copper based alloys and various steels. Hobson and Motzer can provide prototype to high volume production.
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