Sensor Module This RFQ was sourced on www.MFG.com in USA for Pour Molding / Reaction Molding (2-Part Poly) Pour molding of a sensor module. Buyer will provide the molder a small electronic circuit board with wires attached. Molder will form a housing around the small circuit board and return them to buyer. The overall cable assembly is about 6” long. The over- molded electronics are about 1”x 0.100”. A (3 position Molex) connector at the other end of the cable also needs to be over-molded. The wire has 3 conductors with a PVC jacket about 0.125” diameter. Buyer Information Industry Measuring and Control Instruments City/Region Cleveland, Ohio Country USA RFQ RFQ Number 347441 Material Thermoplastic Technical Specifications Category Pour Molding / Reaction Molding (2-Part Poly) Dimensions Get quotes online for manufacturing services at MFG.com from machine shops, fabricators, job shops and contract manufacturers. MFG.com connects buyers and suppliers when the buyer has a need and the supplier has the right expertise and capacity. MFG.com analyzes all engineered parts and RFQs for improved manufacturability and to ensure quality and a quick quoting experience. Pour Molding / Reaction Molding (2-Part Poly): Pour molding is commonly used to make miniature or small parts and parts with simple geometry. A pattern is made and faceted to a work surface. A dam is built around the work surface to contain molten metal or plastic, which is poured into the pattern by a sprue, or channel from the heated chamber.