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Request for Quote Details:
The specific Fabrication processes that were specified were: Other Fabrication.
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Part #
Name
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Category
(Material)
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28046
3 Pole RF Body
See attachments for exact geometry, dimensions and notes. Regarding making via holes and slots on a 60 mil thick silicon wafer. I believe one approach should be to drill midway from the front side, and then flip the wafer over and drill from the back side. I am sending a powerpoint file that has the front and backside masks designs. For the front side, the slots need to be made such that a rectangular area of 10.23 mm x 1.95mm is defined in the silicon wafer. For the back side, only the longer slots (10.23mm) are to be made, otherwise the defined rectangular region would detach from the silicon substrate. All the via holes are 500 microns in diameter. The quotation I need is for 10- 20 wafers...we might be able to spare 1 wafer if you want to do a practice run. Please let me know ASAP about the cost and time involved. Any other ideas about how to fabricate this part is welcome.
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Fabrication:
Other Fabrication
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Technical Specifications
Category
Other Fabrication
Geometry
Cubic
Dimensions
0.0 x 0.0 x 0.0
Attributes
Material Grade
Silicon Wafers
Material Provided by Buyer
No
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